Glonghui May 20 丨 Lehman Optoelectronics (300162crashbandicootpspgames.SZ) announced an announcement of abnormal fluctuations in stock trading. Recently, the concept of glass substrates has attracted the attention of market funds. According to market information, the advanced packaging process used by NVIDIA GB200 will use glass substrates; in addition, Intel, Samsung, AMD, Apple and other major manufacturers have previously stated that they will introduce or explore glass substrate chip packaging technology. The company has self-inspectioncrashbandicootpspgames: The glass substrate packaging technology in the above information refers to the use of a glass-based carrier plate instead of a traditional organic polymer carrier plate for semiconductor chip packaging, which belongs to the application in the field of semiconductor chip packaging. The company's new PM driven glass-based packaging technology is mainly used for MicroLED display panel packaging and cannot be used for semiconductor chip packaging. At the same time, the technology and process of the company's PM driven glass-based display products are constantly improving and improving, and no revenue has been generated at this stage.